Product application:
FOR:
Ideal thermal management/heat-sinking material
-Smart phones, Mobile phones, DSC, DVC, Tablet PCs, PCs , LED Devices
-Semiconductor manufacturing equipment(Sputtering,Dry etching,Steppers)
-Optical communications equipment
OR FOR:
- Ideal sealing material for high-temperature applications
OR FOR:
- Gaskets material in automotive, petroleum and chemical, paper, nuclear industries.
- Thermal barrier at high temperature to provide outstanding reflectivity.
- Fuel cell industry for bipolar plates.
- Excellent for sealing high temperature valves, shafts and flanges.
Advantage:
(1) . High temperature resistance:the operating temperature can be as high as 400℃ and as low as -40℃;
(2) High thermal conductivity:the maximum in-plane thermal conductivity is 1500W/mk;
(3) Corrosion resistance:Resistant to corrosion;
(4) Ease of use:Smooth adhesion to any flat or curved surface